.jpg)
Manufacturing Capabilities
PCB Manufacturing
-
Up to 20 Layers Rigid PCB
-
1100×650 mm Maximum Circuit Size
-
High TG FR4, Polyimide, Aluminium, Ceramic (96% Alumina) Teflon, PTFE (F4B, F4BK), Rogers (4003, 4350, 5880), Taconic (TLX-8, TLX-9), Arlon (35N, 85N) etc
-
Multiple Lamination: 4 - 10 layers ( FR4+Ro4350, FR4+Aluminium, FR4+ FPC)
-
Buried/Blind Hole, Embedded Resistance/Capacity, (Partial) Hybrid, Partial High Density, Back Drilling, Resistance Control.
PCB Assembly & SMT
-
7 Sony High-speed SMT Lines
-
8 million daily SMT placements capability
-
1 million daily DIP placements capability
-
680×500 mm Maximum Board Size
-
0.25"x 0.25" Minimum Board Size
-
450 mm Max. Width for Wave-Solder
-
Passives Components Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement
LINKS
ABOUT
E-mail: info@fs-pcba.com
Tel: +86 755 8696 6026
Phone: +86 137 1530 7049
Add: No. 10A16, 10/F, Yilida Building 2, Nanshan Road, Nanshan District, Shenzhen, Guangdong, China