Manufacturing Capabilities

PCB Manufacturing 

  • Up to 20 Layers Rigid PCB

  • 1100×650 mm Maximum Circuit Size

  • High TG FR4, Polyimide, Aluminium, Ceramic (96% Alumina) Teflon, PTFE (F4B, F4BK), Rogers (4003, 4350, 5880), Taconic (TLX-8, TLX-9), Arlon (35N, 85N) etc

  • Multiple Lamination: 4 - 10 layers ( FR4+Ro4350, FR4+Aluminium, FR4+ FPC)

  • Buried/Blind Hole, Embedded Resistance/Capacity, (Partial) Hybrid, Partial High Density, Back Drilling, Resistance Control.

PCB Assembly & SMT 

  • 7 Sony High-speed SMT Lines

  • 8 million daily SMT placements capability

  • 1 million daily DIP placements capability

  • 680×500 mm Maximum Board Size 

  • 0.25"x 0.25" Minimum Board Size 

  • 450 mm Max. Width for Wave-Solder

  • Passives Components Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement

LINKS
ABOUT

E-mail: info@fs-pcba.com

Tel: +86 755 8696 6026 

Phone: +86 137 1530 7049

Add: No. 10A16, 10/F, Yilida Building 2, Nanshan Road, Nanshan District, Shenzhen, Guangdong, China

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